Low-Temperature Quasi-Direct Copper–Copper Bonding with a Thin Platinum Intermediate Layer Prepared by Atomic Layer Deposition
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چکیده
منابع مشابه
Highly Conformal Thin Films of Tungsten Nitride Prepared by Atomic Layer Deposition from a Novel Precursor
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ژورنال
عنوان ژورنال: Transactions of The Japan Institute of Electronics Packaging
سال: 2020
ISSN: 1883-3365,1884-8028
DOI: 10.5104/jiepeng.13.e19-014-1